GENEVA, Jan. 13 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下３丁目３５番５８号) filed a patent application (PCT/JP2025/012450) for "THERMOPLASTIC RESIN COMPOSITION, MOLDED BODY, METHOD FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION, AND METHOD FOR PRODUCING MOLDED BODY" on Mar 27, 2025. With publication no. WO/2026/009507, the details related to the patent application was published on Jan 08, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intell...