INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "NAPHTHYLENE ETHER RESIN, RESIN COMPOSITION, CURED ARTICLE, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING NAPHTHYLENE ETHER RESIN AND METHOD FOR PRODUCING PHENOLIC RESIN"

GENEVA, April 14 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/021853) for "NAPHTHYLENE ETHER RESIN, RESIN COMPOSITION, CURED ARTICLE, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING NAPHTHYLENE ETHER RESIN, AND METHOD FOR PRODUCING PHENOLIC RESIN" on Jun 17, 2025. With publication no. WO/2026/074762, the details related to the patent application was published on Apr 09, 2026.

Notably, the patent application was submi...