GENEVA, May 5 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/035776) for "MULTILAYERED BODY AND PACKAGING MATERIAL" on Oct 09, 2025. With publication no. WO/2026/088783, the details related to the patent application was published on Apr 30, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KAMIMURA Makoto (c/o DIC Corporation, Tokyo Pla...