GENEVA, April 28 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/035040) for "METHOD FOR DISASSEMBLING BONDED BODY" on Oct 02, 2025. With publication no. WO/2026/083824, the details related to the patent application was published on Apr 23, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YAMADA Shunsuke (c/o DIC Corporation, Central Re...