INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "INK COMPOSITION FOR SOFT PACKAGING LAMINATES, PRINTED MATTER, LAMINATE, OR PACKAGE"

GENEVA, April 14 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/032809) for "INK COMPOSITION FOR SOFT PACKAGING LAMINATES, PRINTED MATTER, LAMINATE, OR PACKAGE" on Sep 18, 2025. With publication no. WO/2026/074923, the details related to the patent application was published on Apr 09, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AO...