GENEVA, May 11 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/036063) for "CONDUCTIVE MATERIAL COMPOSITION, METHOD FOR PRODUCING CONDUCTIVE MATERIAL COMPOSITION, SLURRY FOR SECONDARY BATTERY ELECTRODE CONTAINING SAID CONDUCTIVE MATERIAL COMPOSITION, ELECTRODE, AND SECONDARY BATTERY" on Oct 10, 2025. With publication no. WO/2026/094606, the details related to the patent application was published on May 07, 2026.
Notably, the patent application was submitted under the International Pa...