GENEVA, April 14 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/029311) for "AQUEOUS HEAT-SEALING AGENT FOR CABLES, HEAT-SEALING FILM FOR CABLES, AND CABLE USING SAME" on Aug 21, 2025. With publication no. WO/2026/074824, the details related to the patent application was published on Apr 09, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor...