GENEVA, Aug. 7 -- MICRON TECHNOLOGY, INC. filed a patent application (US2026/013543) for “DIAMOND-BASED HYBRID BONDING FOR STACKED SEMICONDUCTOR SYSTEMS”. With publication no. WO/2026/165503, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 80/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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