INTERNATIONAL PATENT: DENSO CORPORATION, 株式会社デンソー FILES APPLICATION FOR "PROCESSED WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE"

GENEVA, Feb. 3 -- DENSO CORPORATION (1-1, Showa-cho, Kariya-city, Aichi4488661), 株式会社デンソー (愛知県刈谷市昭和町１丁目１番地) filed a patent application (PCT/JP2025/025969) for "PROCESSED WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE" on Jul 22, 2025. With publication no. WO/2026/023620, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TSUKAHARA, Hajime (c/o DENSO CORPORAT...