GENEVA, April 28 -- DENSO CORPORATION (1-1, Showa-cho, Kariya-city, Aichi4488661), 株式会社デンソー (愛知県刈谷市昭和町１丁目１番地) filed a patent application (PCT/JP2025/036091) for "INSPECTION DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP" on Oct 13, 2025. With publication no. WO/2026/083942, the details related to the patent application was published on Apr 23, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): IWATSUKI, Masashi (c/o DENSO CORPOR...