INTERNATIONAL PATENT: DENSO CORPORATION, 株式会社デンソー FILES APPLICATION FOR "HEAT PUMP FUNCTION ASSEMBLY AND HEAT PUMP MODULE"

GENEVA, March 17 -- DENSO CORPORATION (1-1, Showa-cho, Kariya-city, Aichi4488661), 株式会社デンソー (愛知県刈谷市昭和町１丁目１番地) filed a patent application (PCT/JP2025/025869) for "HEAT PUMP FUNCTION ASSEMBLY AND HEAT PUMP MODULE" on Jul 22, 2025. With publication no. WO/2026/053608, the details related to the patent application was published on Mar 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MIEDA Hiroshi (C/O DENSO CORPORATION, 1-1, Showa-cho...