GENEVA, Oct. 30 -- SHENZHEN UNIVERSITY filed a patent application (CN2026/082316) for “DEFORMATION MONITORING METHOD FOR LARGE-SCALE STRUCTURE AND RELATED APPARATUS”. With publication no. WO/2026/223249, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G01B 11/16
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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