GENEVA, Sept. 18 -- UNICOMP TECHNOLOGY (GROUP) CO., LTD. filed a patent application (CN2026/081577) for “DEFECT DETECTION METHOD AND APPARATUS FOR CERAMIC MODULE, AND DEVICE AND STORAGE MEDIUM”. With publication no. WO/2026/184676, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G06T 7/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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