International Patent: DEDICATED INTERFACE FOR FOLDING DATA FROM VOLATILE MEMORY (VM) DIES TO STACKED NON-VOLATILE MEMORY (NVM) DIE

GENEVA, July 9 -- MICRON TECHNOLOGY, INC. filed a patent application (US2025/061522) for “DEDICATED INTERFACE FOR FOLDING DATA FROM VOLATILE MEMORY (VM) DIES TO STACKED NON-VOLATILE MEMORY (NVM) DIE”. With publication no. WO/2026/147910, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G11C 5/06

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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