GENEVA, May 5 -- DAICEL CORPORATION (3-1, Ofuka-cho, Kita-ku, Osaka-shi, Osaka5300011), 株式会社ダイセル (大阪府大阪市北区大深町３番１号) filed a patent application (PCT/JP2025/032835) for "POLYESTER RESIN COMPOSITION AND RESIN MOLDED ARTICLE" on Sep 18, 2025. With publication no. WO/2026/088661, the details related to the patent application was published on Apr 30, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SAITO Itsuki (c/o Polyplastics Co., Ltd., 9...