INTERNATIONAL PATENT: DAI NIPPON PRINTING CO., LTD., 大日本印刷株式会社 FILES APPLICATION FOR "OUTER PACKAGING MATERIAL FOR VACUUM HEAT-INSULATING MATERIAL, VACUUM HEAT-INSULATING MATERIAL, ARTICLE WITH VACUUM HEAT-INSULATING MATERIAL AND METHOD FOR PRODUCING OUTER PACKAGING MATERIAL FOR VACUUM HEAT-INSULATING MATERIAL"

GENEVA, Feb. 3 -- DAI NIPPON PRINTING CO., LTD. (1-1, Ichigaya-kagacho 1-chome, Shinjuku-ku, Tokyo1628001), 大日本印刷株式会社 (東京都新宿区市谷加賀町一丁目１番１号) filed a patent application (PCT/JP2025/025581) for "OUTER PACKAGING MATERIAL FOR VACUUM HEAT-INSULATING MATERIAL, VACUUM HEAT-INSULATING MATERIAL, ARTICLE WITH VACUUM HEAT-INSULATING MATERIAL, AND METHOD FOR PRODUCING OUTER PACKAGING MATERIAL FOR VACUUM HEAT-INSULATING MATERIAL" on Jul 17, 2025. With publication no. WO/2026/023538, the details related to the patent application was published on Jan 29, 2026.

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