GENEVA, Aug. 31 -- MOMENTIVE PERFORMANCE MATERIALS INC. filed a patent application (US2026/016010) for “CURABLE SILICONE COMPOSITION WITH HIGH HEAT RESISTANCE”. With publication no. WO/2026/178342, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 83/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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