International Patent: CURABLE RESIN, RESIN CONTAINING HALOETHYL GROUP, METHOD FOR PRODUCING CURABLE RESIN, CURABLE COMPOSITION, CURED OBJECT, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR-SEALING MATERIAL, AND SEMICONDUCTOR DEVICE

GENEVA, July 6 -- DIC CORPORATION filed a patent application (JP2025/038249) for “CURABLE RESIN, RESIN CONTAINING HALOETHYL GROUP, METHOD FOR PRODUCING CURABLE RESIN, CURABLE COMPOSITION, CURED OBJECT, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR-SEALING MATERIAL, AND SEMICONDUCTOR DEVICE”. With publication no. WO/2026/140498, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08G 61/02

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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