INTERNATIONAL PATENT: CORNING INCORPORATED FILES APPLICATION FOR "METHODS AND SYSTEMS FOR FORMING VIAS"

GENEVA, March 31 -- CORNING INCORPORATED (One Riverfront PlazaCorning, New York 14831) filed a patent application (PCT/US2025/046722) for "METHODS AND SYSTEMS FOR FORMING VIAS" on Sep 17, 2025. With publication no. WO/2026/064363, the details related to the patent application was published on Mar 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LANCE, David Mark (50 Palisades Blvd.Elmira, New York 14903), STRELTSOV, Alexander Mikhailovich (10879 Hidden Meadow TrailCorning, New York 14830)

Abstract: A method of processing a substrate includes directing a pulsed laser beam through a window...