International Patent: CORE-INTEGRATED MODULAR ELEVATOR STRUCTURE AND MODULAR ELEVATOR CONSTRUCTION METHOD USING SAME

GENEVA, July 31 -- SAMSUNG C&T CORPORATION filed a patent application (KR2025/020825) for “CORE-INTEGRATED MODULAR ELEVATOR STRUCTURE AND MODULAR ELEVATOR CONSTRUCTION METHOD USING SAME”. With publication no. WO/2026/160603, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B66B 11/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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