International Patent: COOLING ARRANGEMENTS FOR PROCESSING SYSTEMS, CHAMBERS, AND RELATED METHODS TO MODIFY SUBSTRATE TEMPERATURE PROFILES

GENEVA, June 24 -- APPLIED MATERIALS, INC. filed a patent application (US2025/049881) for “COOLING ARRANGEMENTS FOR PROCESSING SYSTEMS, CHAMBERS, AND RELATED METHODS TO MODIFY SUBSTRATE TEMPERATURE PROFILES”. With publication no. WO/2026/117314, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 72/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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