International Patent: CONNECTOR, SUBSTRATE ASSEMBLY, AND SYSTEM STRUCTURE

GENEVA, Oct. 15 -- YAMAICHI ELECTRONICS CO., LTD. filed a patent application (JP2026/014691) for “CONNECTOR, SUBSTRATE ASSEMBLY, AND SYSTEM STRUCTURE”. With publication no. WO/2026/216602, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01R 31/06

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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