International Patent: CONNECTOR, ELECTRONIC ASSEMBLY, ELECTRONIC DEVICE AND SIGNAL TRANSMISSION METHOD

GENEVA, July 2 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/141426) for “CONNECTOR, ELECTRONIC ASSEMBLY, ELECTRONIC DEVICE AND SIGNAL TRANSMISSION METHOD”. With publication no. WO/2026/130187, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01R 13/6461

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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