GENEVA, Nov. 6 -- DIC CORPORATION filed a patent application (JP2026/015339) for “CONDUCTIVE HEAT SEAL COMPOSITION AND RESIN LAMINATED FILM”. With publication no. WO/2026/230337, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09D 133/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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