GENEVA, Sept. 18 -- ENTEGRIS, INC. filed a patent application (US2026/017825) for “COMPOSITIONS FOR UNIFORM ETCHING OF HIGH ASPECT RATIO STRUCTURES”. With publication no. WO/2026/187988, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C23F 1/30

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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