International Patent: COMPOSITION FOR ETCHING TREATMENT, ETCHING TREATMENT METHOD, PLATING METHOD, ARTICLE, AND PRODUCT

GENEVA, Aug. 21 -- OKUNO CHEMICAL INDUSTRIES CO., LTD. filed a patent application (JP2026/005346) for “COMPOSITION FOR ETCHING TREATMENT, ETCHING TREATMENT METHOD, PLATING METHOD, ARTICLE, AND PRODUCT”. With publication no. WO/2026/173099, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C23C 18/24

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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