GENEVA, Sept. 24 -- ASAHI KASEI KABUSHIKI KAISHA filed a patent application (JP2025/045182) for “COMPOSITION, HARDENER, RESIN COMPOSITION, EPOXY RESIN COMPOSITION, ENCAPSULATION MATERIAL, ELECTROCONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, INSULATING MATERIAL, ADHESIVE FOR CAMERA MODULE, STRUCTURAL ADHESIVE, MATRIX RESIN FOR FIBER-REINFORCED PLASTIC, INFILTRATING FIXATIVE, INTERLAYER DIELECTRIC FILM, FILM-SHAPED SOLDER RESIST, ENCAPSULATION SHEET, ELECTROCONDUCTIVE FILM, ANISOTROPIC ELECTROCONDUCTIVE FILM, THERMALLY CONDUCTIVE FILM, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE”. With publication no. WO/2026/196744, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08G 59/5...