GENEVA, June 26 -- SINGAPORE UNIVERSITY OF TECHNOLOGY AND DESIGN filed a patent application (SG2025/050770) for “COMPOSITES FOR SACRIFICIAL MOULDING AND METHODS THEREOF”. With publication no. WO/2026/122024, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08L 29/04

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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