GENEVA, July 6 -- PI ADVANCED MATERIALS CO., LTD. filed a patent application (KR2025/021418) for “COMPOSITE FILM COMPRISING THERMOPLASTIC POLYIMIDE LAYER AND NON-THERMOPLASTIC POLYIMIDE LAYER, AND METHOD FOR MANUFACTURING SAME”. With publication no. WO/2026/142090, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08J 5/18
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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