GENEVA, Oct. 5 -- TOKYO SEIMITSU CO., LTD. filed a patent application (JP2026/012629) for “CMP DEVICE”. With publication no. WO/2026/205439, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B24B 57/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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