GENEVA, Oct. 5 -- SHENZHEN PANGO MICROSYSTEMS CO., LTD. filed a patent application (CN2026/083520) for “CML-TO-CMOS LOGIC CIRCUIT, CHIP, AND ELECTRONIC DEVICE”. With publication no. WO/2026/200577, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H03K 19/173
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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