GENEVA, June 24 -- HONOR DEVICE CO., LTD. filed a patent application (CN2025/145339) for “CIRCUIT BOARD STRUCTURE, MANUFACTURING METHOD, MAIN BOARD, AND ELECTRONIC APPARATUS”. With publication no. WO/2026/114432, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 1/18
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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