GENEVA, July 2 -- RESIDEO LLC filed a patent application (US2025/059660) for “CIRCUIT BOARD CONFIGURATION FOR THERMALLY INSULATING AN EMBEDDED TEMPERATURE SENSOR”. With publication no. WO/2026/136244, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G01K 7/22
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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