International Patent: CIRCUIT ARRANGEMENT AND INPUT MODULE HAVING SUCH A CIRCUIT ARRANGEMENT

GENEVA, July 2 -- SIEMENS AKTIENGESELLSCHAFT filed a patent application (EP2025/083176) for “CIRCUIT ARRANGEMENT AND INPUT MODULE HAVING SUCH A CIRCUIT ARRANGEMENT”. With publication no. WO/2026/130909, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G05B 19/042

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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