INTERNATIONAL PATENT: CHIU, PO-WEN FILES APPLICATION FOR "METHOD AND APPARATUS FOR ATOMIC LAYER DEPOSITION USING MULTIPLE CHAMBERS"

GENEVA, Feb. 15 -- CHIU, Po-Wen (No. 101, Sec. 2, Kwangfu Rd., Hsinchu CityTaiwan 30013) filed a patent application (PCT/CN2024/110976) for "METHOD AND APPARATUS FOR ATOMIC LAYER DEPOSITION USING MULTIPLE CHAMBERS" on Aug 09, 2024. With publication no. WO/2026/031157, the details related to the patent application was published on Feb 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YEN, Jui-Kang (12F., No. 561, Sec. 1, Xinglong Rd., Zhubei City, Hsinchu CountyTaiwan 302056)

Abstract: A method for implementing a thin film deposition process includes: transporting a substrate(60) into a fi...