International Patent: CHIP PACKAGING STRUCTURE, RADIO FREQUENCY FRONT-END MODULE AND ELECTRONIC DEVICE

GENEVA, July 9 -- RADROCK (CHONGQING) MICROELECTRONICS CO., LTD. filed a patent application (CN2025/136474) for “CHIP PACKAGING STRUCTURE, RADIO FREQUENCY FRONT-END MODULE AND ELECTRONIC DEVICE”. With publication no. WO/2026/144629, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10D 80/30

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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