GENEVA, Aug. 7 -- NEO SEMICONDUCTOR, INC. filed a patent application (US2026/013567) for “CHIP DESIGN ARCHITECTURES AND OPERATIONS”. With publication no. WO/2026/165516, here are the other details related to the patent application:
Kind: Initial Publication without ISR [A2]
IPC: G06N 3/063
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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