International Patent: CHIP AND PREPARATION METHOD THEREFOR, PACKAGE SUBSTRATE AND PREPARATION METHOD THEREFOR, CHIP PACKAGE STRUCTURE, TERMINAL DEVICE, AND COMMUNICATION SYSTEM

GENEVA, July 6 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/145963) for “CHIP AND PREPARATION METHOD THEREFOR, PACKAGE SUBSTRATE AND PREPARATION METHOD THEREFOR, CHIP PACKAGE STRUCTURE, TERMINAL DEVICE, AND COMMUNICATION SYSTEM”. With publication no. WO/2026/139027, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 74/10

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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