International Patent: CHIP, ELECTRONIC DEVICE, CAPACITOR, AND MANUFACTURING METHOD THEREFOR

GENEVA, July 18 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/110623) for “CHIP, ELECTRONIC DEVICE, CAPACITOR, AND MANUFACTURING METHOD THEREFOR”. With publication no. WO/2026/148838, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10D 1/60

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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