GENEVA, April 17 -- CHENGDU HUAMING MICROWAVE TECHNOLOGY CO., LTD. (No. 117, South 3rd Road, Chengdu Economic Development Zone, Sichuan ProvinceChengdu, Sichuan 610100), 成都华铭电子科技有限公司 (中国四川省成都市四川省成都经济技术开发区（龙泉驿区）南三路117号) filed a patent application (PCT/CN2025/119349) for "SOLDER-FREE MOUNTABLE HIGH-PERFORMANCE VERTICAL INTERCONNECT RADIO FREQUENCY CONNECTOR" on Sep 05, 2025. With publication no. WO/2026/077157, the details related to the patent applicati...