International Patent: CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING PATTERNED RESIST FILM, AND METHOD FOR PRODUCING PLATED MODELED OBJECT

GENEVA, Nov. 6 -- TOKYO OHKA KOGYO CO., LTD. filed a patent application (JP2026/016768) for “CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING PATTERNED RESIST FILM, AND METHOD FOR PRODUCING PLATED MODELED OBJECT”. With publication no. WO/2026/230512, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G03F 7/004

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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