GENEVA, July 6 -- ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD filed a patent application (CN2025/134291) for “CHEMICAL MECHANICAL POLISHING SLURRY”. With publication no. WO/2026/138223, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09G 1/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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