International Patent: CHEMICAL-MECHANICAL POLISHING SLURRY, POLISHING METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD

GENEVA, Oct. 30 -- TOPPAN INFOMEDIA INC. filed a patent application (JP2026/001552) for “CHEMICAL-MECHANICAL POLISHING SLURRY, POLISHING METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD”. With publication no. WO/2026/225022, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 52/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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