GENEVA, March 23 -- CARL ZEISS SMT GMBH (Rudolf-Eber-Strasse 273447 Oberkochen) filed a patent application (PCT/EP2025/074179) for "COMPUTER IMPLEMENTED METHOD FOR CONTROLLING A SLICE THICKNESS WHEN GENERATING A 3D TOMOGRAPHIC IMAGE OF AN INSPECTION VOLUME IN A SEMICONDUCTOR WAFER" on Aug 25, 2025. With publication no. WO/2026/057324, the details related to the patent application was published on Mar 19, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KORB, Thomas (Rudolf-Eber-Strasse 273447 Oberkochen)
Abstract: The invention relates to a system and method for controlling a slice thickness...