INTERNATIONAL PATENT: CAMBRIDGE GAN DEVICES LIMITED FILES APPLICATION FOR "FAN-OUT PANEL-LEVEL PACKAGING WITH DIRECT BONDED COPPER"

GENEVA, Dec. 29 -- CAMBRIDGE GAN DEVICES LIMITED (Jeffreys Building, Suite 8St Johns Innovation ParkCowley RoadCambridge Cambridgeshire CB4 0DS) filed a patent application (PCT/EP2025/066982) for "FAN-OUT PANEL-LEVEL PACKAGING WITH DIRECT BONDED COPPER" on Jun 17, 2025. With publication no. WO/2025/262084, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): STACEY, Simon (2 Alexander ChaseEly Cambridgeshire CB6 3SW), CHEN, Di (c/o Cambridge GaN Devices LimitedJeffreys Building, Suite 8St Johns Innovation ParkCowley RoadCambri...