GENEVA, Feb. 17 -- C-CLICK (265 AVENUE DES BARONNES34730 PRADES-LE-LEZ) filed a patent application (PCT/EP2025/072870) for "ELECTROSTATIC WAFER CLAMPING DEVICE AND METHOD" on Aug 08, 2025. With publication no. WO/2026/033113, the details related to the patent application was published on Feb 12, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): BOURGARIT, Mathieu (428 avenue de Boisseron34160 Saussines)
Abstract: The invention relates to an electrostatic wafer clamping device (400) comprising: - at least two electrodes (405, 410), connected to at least two phases (406, 411) of a control unit,...