INTERNATIONAL PATENT: BYD COMPANY LIMITED, 比亚迪股份有限公司 FILES APPLICATION FOR "TERMINAL STRUCTURE OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR DEVICE, POWER MODULE, POWER ELECTRONIC DEVICE AND VEHICLE"

GENEVA, Jan. 4 -- BYD COMPANY LIMITED (No.3009, BYD Road, Pingshan,Shenzhen, Guangdong 518118), 比亚迪股份有限公司 (中国广东省深圳市坪山区比亚迪路3009号) filed a patent application (PCT/CN2025/081061) for "TERMINAL STRUCTURE OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR DEVICE, POWER MODULE, POWER ELECTRONIC DEVICE, AND VEHICLE" on Mar 06, 2025. With publication no. WO/2026/001070, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, whic...