GENEVA, Sept. 24 -- YAMAHA ROBOTICS CO., LTD. filed a patent application (JP2025/010337) for “BONDING DEVICE, METHOD, AND PROGRAM”. With publication no. WO/2026/196404, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/60
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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