GENEVA, July 6 -- TOKYO ELECTRON LIMITED filed a patent application (JP2025/045096) for “BONDING DEVICE, BONDING METHOD, AND BONDING SYSTEM”. With publication no. WO/2026/141399, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10P 10/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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