GENEVA, Aug. 31 -- THE JAPAN STEEL WORKS, LTD. filed a patent application (JP2026/004989) for “BONDED SUBSTRATE, BONDED SUBSTRATE WITH DEVICE, AND METHOD FOR MANUFACTURING BONDED SUBSTRATE WITH DEVICE”. With publication no. WO/2026/177027, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H03H 9/25
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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